High heat conduction and high attenuation backing material for ultrasonic phased array probe and manufacturing method thereof

一种用于超声相控阵探头的高导热高衰减的背衬材料及其制造方法

Abstract

A high heat conduction and high attenuation backing material for ultrasonic phased array probe is made from lutecium oxide, alumina, a tungsten compound material and an epoxy adhesive and is characterized in that the epoxy adhesive is prepared by mixing epoxy resin E-54 and triethanolamine; the tungsten compound material is prepared by mixing rubber and a tungsten powder; and the alumina accounts for 10.48-53.04wt% of the backing material. A manufacturing method of the backing material comprises the following steps of: (a) mixing the epoxy resin E-54, lutecium oxide, alumina and the tungsten compound material with stirring, wherein the epoxy resin E-54 accounts for 6.22% the total weight of the backing material and alumina accounts for 10.48-53.04wt% of the backing material; (b) adding triethanolamine which accounts for 0.95% the total weight of the backing material into the above composite particles with stirring; (c) putting the composite particles into a die, and extruding the composite particles into the required backing material by the use of a powder pressing machine; and (d) putting the pressed backing material into an air-blasting heating oven of 65 DEG C for heating-curing. The thermal conductivity of the backing material is 1.782W/(m.k), its specific acoustic impedance is 8.42*106Pa.s/m and its acoustic attenuation coefficient at 5MHz is 294.4dB/cm. The backing material has high thermal conductivity and high attenuation. In addition, the sensitivity and resolution of the phased array probe produced by the use of the backing material can satisfy the requirement for application.
一种适用于超声相控阵探头的高导热高衰减的背衬材料,由三氧化二镥、氧化铝、复合材料钨粉和环氧胶粘剂组成,其特征在于,所述环氧胶粘剂由环氧树脂E-54、三乙醇胺搅拌混合制得,所述复合材料钨粉是由橡胶与钨粉混炼而成的。其中氧化铝占背衬材料的质量百分比为:10.48%-53.04%。其制造方法包括以下步骤:(a)将环氧树脂E-54、三氧化二镥、氧化铝、复合材料钨粉搅拌混合,其中环氧树脂E-54占背衬材料总质量的6.22%,氧化铝占背衬材料质量百分比的10.48%-53.04%。(b)将占背衬材料总质量的0.95%的三乙醇胺加入上述的复合颗粒中,搅拌混合。(c)将复合颗粒装入模具中,利用粉末压片机将其挤压成所需的背衬材料。(d)将压制好的背衬材料放进炉温为65℃的鼓风加热烤箱中,加热固化。该背衬材料的热传导系数为1.782W/(m.k),声阻抗率为8.42×106Pa.s/m,在5MHz时的声衰减系数为294.4dB/cm。这种背衬材料具有高导热性和高衰减的特点,而且用这种背衬材料制作的相控阵探头,探头的灵敏度和分辨率都得到满足应用的要求。

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Cited By (2)

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    CN-104552718-AApril 29, 2015深圳市理邦精密仪器股份有限公司一种高衰减背衬材料的制备方法